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Sireda


Save on Sireda products at In The National Interest. Hurry! Limited time offers. Offers valid only while supplies last.



BGA88 Socket F Solution_8X11mm_0.8 Pitch Premium, IC Programmer Socket Test Socket, NAND Flash Test Adapter
BGA88 Socket F Solution_8X11mm_0.8 Pitch Premium, IC Programmer Socket Test Socket, NAND Flash Test Adapter
In Stock
$727.00

mpn: 702-0000296,

Features1.F solution is designed for test, debug, and validation of devices of BGA, LGA, QFP, QFN, SOP, etc. 2.The compact, surface mount design requires no tooling, no extra place or mounting holes in the target PC board, maximizing real estate whil...


BGA88 Socket F Solution_11X11mm_0.8 Pitch Premium, IC Programmer Socket Test Socket, NAND Flash Test Adapter
BGA88 Socket F Solution_11X11mm_0.8 Pitch Premium, IC Programmer Socket Test Socket, NAND Flash Test Adapter
In Stock
$727.00

mpn: 702-0000297,

Features 1.F solution is designed for test, debug, and validation of devices of BGA, LGA, QFP, QFN, SOP, etc. 2.The compact, surface mount design requires no tooling, no extra place or mounting holes in the target PC board, maximizing real estate whi...


BGA153 Socket USB Solution_ Pitch 0.5mm _ 11.5x13mm ,High-speed Read & Write Solution,eMMC Test, IC Socket
BGA153 Socket USB Solution_ Pitch 0.5mm _ 11.5x13mm ,High-speed Read & Write Solution,eMMC Test, IC Socket
In Stock
$525.00

mpn: 703-0000167,

1. Pogo Pin Solution 2. Engineering Material 3. Adopt PPS As The Insulation Material 4. Compatible With 153 5. Accurate Positioning On Test Pad or Solder Ball 6. Long Life Span, High Quality and Stable Performance 7. Pressure Ajustable Design So As T...


BGA529 Socket SD Solution _15x15mm_Pitch 0.5mm_Perform, IC Test Socket,eMCP socket For KMR210008M-A805 SAMSUNG Note 4 Flash Data Recovery
BGA529 Socket SD Solution _15x15mm_Pitch 0.5mm_Perform, IC Test Socket,eMCP socket For KMR210008M-A805 SAMSUNG Note 4 Flash Data Recovery
In Stock
$532.00

mpn: 703-0000828,

1. Pogo Pin Solution 2. Engineering Material 3. Adopt PPS As The Insulation Material 4. Compatible With 529 5. Accurate Positioning On Test Pad or Solder Ball 6. Long Life Span, High Quality and Stable Performance 7. Pressure Ajustable Design So As T...


BGA153 Socket USB Solution_ Pitch 0.5mm _ 11.5x13mm ,High-speed Read & Write Solution,Clamshell Structure,eMMC Test Socket
BGA153 Socket USB Solution_ Pitch 0.5mm _ 11.5x13mm ,High-speed Read & Write Solution,Clamshell Structure,eMMC Test Socket
In Stock
$525.00

mpn: 703-0000166,

1. Pogo Pin Solution 2. Engineering Material 3. Adopt PPS As The Insulation Material 4. Compatible With 153 5. Accurate Positioning On Test Pad or Solder Ball 6. Long Life Span, High Quality and Stable Performance 7. Pressure Ajustable Design So As T...


BGA529 Socket SD Solution _15x15mm_Pitch 0.5mm_Premium, IC Test Socket,eMCP socket For KMR210008M-A805 SAMSUNG Note 4 Flash Data Recovery
BGA529 Socket SD Solution _15x15mm_Pitch 0.5mm_Premium, IC Test Socket,eMCP socket For KMR210008M-A805 SAMSUNG Note 4 Flash Data Recovery
In Stock
$562.00

mpn: 703-0000827,

1. Pogo Pin Solution 2. Engineering Material 3. Adopt PPS As The Insulation Material 4. Compatible With 529 5. Accurate Positioning On Test Pad or Solder Ball 6. Long Life Span, High Quality and Stable Performance 7. Pressure Ajustable Design So As T...


BGA529_15x15mm_eMCP Test Socket For Samsung Note 4 ,IC Programmer Adapter USB3.0 Interface
BGA529_15x15mm_eMCP Test Socket For Samsung Note 4 ,IC Programmer Adapter USB3.0 Interface
In Stock
$592.00

mpn: 703-0000230,

1. Pogo Pin Solution 2. Engineering Material 3. Adopt PPS As The Insulation Material 4. Compatible With 529 5. Accurate Positioning On Test Pad or Solder Ball 6. Long Life Span, High Quality and Stable Performance 7. Pressure Ajustable Design So As T...


BGA169(eMMC) Reball Kit_14X18mm,NAND Flash Repair, BGA153 Reballing Kit Tool, NAND Flash Reballing, eMMC Replacement,5sets/lot
BGA169(eMMC) Reball Kit_14X18mm,NAND Flash Repair, BGA153 Reballing Kit Tool, NAND Flash Reballing, eMMC Replacement,5sets/lot
In Stock
$810.00

mpn: 705-0000495,

Specification 1.Steel Dimensions: (80 x 80) mm, apply to BGA169, size: 14X18mm2.The unique tin ball storage room design, no need to poure out excess solder ball every time, make production more efficiency. 3.For more other BGA Reballing Kit, please c...


Sireda BGA153 UFS Test Socket F1 Solution Apply For 153 Ball _Pitch 0.5mm _ IC Size 11.5X13mm
Sireda BGA153 UFS Test Socket F1 Solution Apply For 153 Ball _Pitch 0.5mm _ IC Size 11.5X13mm
In Stock
$786.00

mpn: 17-0000040,

How it works 1.F1 solution is designed for test, debug, and validation of devices of BGA, LGA, QFP, QFN, SOP, etc. 2.The compact, surface mount design requires no tooling, no extra place or mounting holes in the target PC board, maximizing real estat...


Sireda BGA136 Socket Test Socket Apply for 136 Ball 0.8mm Pitch Chip Size 12x14mm
Sireda BGA136 Socket Test Socket Apply for 136 Ball 0.8mm Pitch Chip Size 12x14mm
In Stock
$852.00

mpn: 702-0000284,

Features1.F solution is designed for test, debug, and validation of devices of BGA, LGA, QFP, QFN, SOP, etc. 2.The compact, surface mount design requires no tooling, no extra place or mounting holes in the target PC board, maximizing real estate whil...



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