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🎉 Applications:Mounting transparent foils, windows for EMI/RFI shieldingShielding of all non-conductive materialsEMI shielding tape/gasketAntistatic floors (ESD floors)Electrical connection between surfacesShielding in housings and Faraday ca...
mpn: CFT -02,
Copper tape can be an interesting addition to your toolbox. The tape itself is made of thin pure copper so its extremely flexible and can take on nearly any shape. You can easily solder to it, and the tape itself can carry current just like a wire. O...
mpn: CFT-01, ean: 6165309175270,
Copper tape can be an interesting addition to your toolbox. The tape itself is made of thin pure copper so its extremely flexible and can take on nearly any shape. You can easily solder to it, and the tape itself can carry current just like a wire. O...
mpn: CT, ean: 0683203920681,
Self-adhesive copper foil tape. Each roll is 12yards long and 1 inch wide. The tape has Dual conductivity so current will flow through both sides and the adhesive. One side is coated with a strong adhesive which is protected by paper backing on the...
mpn: CT2, ean: 0635131049200,
Self-adhesive copper foil tape. Each roll is 6 yards long and 2 inch wide. The tape has Dual conductivity so current will flow through both sides and the adhesive. One side is coated with a strong adhesive which is protected by paper backing on the...
mpn: 8330S-200ML, ean: 0779008833032,
The 8330S Silver Conductive Epoxy Adhesive: Slow Cure/Extreme Conductivity is an electronic grade epoxy that combines long working time and high conductivity with ease of use. It has a convenient 1-to-1 mix ratio and 4–5 hours pot life, which once ...
mpn: Silver-Bond 4-250,
Benefits: High strengthExcellent mechanical, electrical properties Substrates: Excellent choice for Integrated Circuits, aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, phenolic and G-10 epoxy glass boards. Typical application: mi...
mpn: Silver-Easy-Mix 07-250,
Mix Ratio by weight: 100:100 / Resin:Hardener Glass Transition Temp, Tg: 50 C Minimum Bond Line Thickness: 1mm Substrates: Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass board...
mpn: Flexible-Silver 19-250,
Mix Ratio by weight: 90:100 / Resin:Hardener Substrates: Metal, ceramics, glass and plastic Thixotropic Index: 4.9 Typical Application: Assembly and repair of electrical modules, flexible circuits, membrane switches, wave guides, flat cable and high ...
mpn: Silver-Bond 24-250,
Mix Ratio by weight: 100:5 / Resin:Hardener Substrates: Excellent choice for aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards Typical Application: assembly, manufacture and repair of elec...