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BGA153 Socket USB Solution_ Pitch 0.5mm _ 11.5x13mm ,High-speed Read & Write Solution,Clamshell Structure,eMMC Test Socket


BGA153 Socket USB Solution_ Pitch 0.5mm _ 11.5x13mm ,High-speed Read & Write Solution,Clamshell Structure,eMMC Test Socket by Sireda at In The National Interest. MPN: 703-0000166. Hurry! Limited time offer. Offer valid only while supplies last. 1. Pogo Pin Solution 2. Engineering Material 3. Adopt PPS As The Insulation Material 4. Compatible With 153 5. Accurate Positioning On Test Pad or


Product Description

1. Pogo Pin Solution
2. Engineering Material
3. Adopt PPS As The Insulation Material
4. Compatible With 153
5. Accurate Positioning On Test Pad or Solder Ball
6. Long Life Span, High Quality and Stable Performance
7. Pressure Ajustable Design So As To Compatible With IC Thickness From 0.8-1.5mm
8. Realization Of Reading and Access The Data Of NAND Flash-eMMC
9.Compatible With Samsung,Hynix,Sandisk,Toshiba,Intel,etc
10.Could Apply To ≤ eMMC5.0(Please Note)
11. Apply IC Size: 11.5x13mm

Features & Highlights

  • Apply to eMMC Size 11.5*13mm,Thickness From 0.8-1.5mm
  • Upload and Download Data
  • Apply to Samsung,Sandisk,Toshiba,Hynix,Micron,HTC,MTK,Intel, etc--eMMC
  • Adopt PPS As The Insulation Material
  • Write and Read test speed up to 180.9MB/S(Test chip brand:Samsung, Part Number:KLMB64GEND)

Additional Information

Manufacturer:Sireda
Brand:Sireda
Part Number:703-0000166
Publisher:Sireda
Studio:Sireda
MPN:703-0000166

BGA153 Socket USB Solution_ Pitch 0.5mm _ 11.5x13mm ,High-speed Read & Write Solution,Clamshell Structure,eMMC Test Socket by Sireda

Buy Now:
BGA153 Socket USB Solution_ Pitch 0.5mm _ 11.5x13mm ,High-speed Read & Write Solution,Clamshell Structure,eMMC Test Socket

Brand: Sireda
Condition: New
Lead Time: 1 - 2 Business Days
Availability: In Stock
$525.00


Quantity:  

 


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