1. Pogo Pin Solution
2. Engineering Material
3. Adopt PPS As The Insulation Material
4. Compatible With 529
5. Accurate Positioning On Test Pad or Solder Ball
6. Long Life Span, High Quality and Stable Performance
7. Pressure Ajustable Design So As To Compatible With IC Thickness From 0.8-1.5mm
8. Realization Of Reading and Access The Data Of NAND Flash-eMMC
9. eMCP socket For KMR210008M-A805 SAMSUNG Note 4
10. Apply IC Size: 15x15mm
Features & Highlights
- Apply to eMCP Size 15*15mm,Thickness From 0.8-1.5mm
- USB port
- Apply to Samsung KMR210008M-A805 Note 4 Chip
- Adopt PPS As The Insulation Material
- eMCP Test Socket
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Specification 1.Steel Dimensions: (80 x 80) mm, apply to BGA169, size: 14X18mm2.The unique tin ball storage room design, no need to poure out excess solder ball every time, make production more efficiency. 3.For more other BGA Reballing Kit, please c...
How it works 1.F1 solution is designed for test, debug, and validation of devices of BGA, LGA, QFP, QFN, SOP, etc. 2.The compact, surface mount design requires no tooling, no extra place or mounting holes in the target PC board, maximizing real estat...
Features1.F solution is designed for test, debug, and validation of devices of BGA, LGA, QFP, QFN, SOP, etc. 2.The compact, surface mount design requires no tooling, no extra place or mounting holes in the target PC board, maximizing real estate whil...