Login       My Wishlist
  My Cart
$0.00 / 0 items
 
In The National Interest
Politics and Policy in the Interest of the Nation
 
International Access
Global Shipping Options Available
Home About Us News Our Blog Our Catalog My Cart My Account Track Shippment Contact Us
  Our Catalog   Tapes, Adhesives & Sealants   Conductive Adhesives

Silver-Bond 4 Electrically Conductive, Heat Resistant, Silver Epoxy Adhesive


Silver-Bond 4 Electrically Conductive, Heat Resistant, Silver Epoxy Adhesive by Epoxy International at In The National Interest. MPN: Silver-Bond 4-250. Hurry! Limited time offer. Offer valid only while supplies last. Benefits: High strengthExcellent mechanical, electrical properties Substrates: Excellent choice for Integrated Circuits, aluminum, copper, magnesium,


Product Description

Benefits: High strengthExcellent mechanical, electrical properties Substrates: Excellent choice for Integrated Circuits, aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, phenolic and G-10 epoxy glass boards. Typical application: microwave applications for EMI and FRI shielding, for assembly and repair of circuit boards and electronic component manufacturing. 2 hours: @ 125C 1 hour: @ 150C 1/2 hours: @ 175C Viscosity @ 25 C cps: 200,000 Shelf life: 6 Months Density: 3.6 Thermal Conductivity, btu/hr/ft2/F/in: 16.1 Coefficient of Thermal Expansion: 60x 10^-6 (in/in) C Operating Temperature: -55C to +175CIntermit. to 325 Volume Resistivity ohm. cm: < 0.001 TML (Total Mass Loss): % 0.38 CVCM (Collected Volatile Condensable Materials) %: 0.01 WVR (Water Vapor Recovery) %: 0.07 Silver-Bond 4 Electrically Conductive, Heat Resistant, Silver Epoxy Adhesive is a single component, heat curing, conductive epoxy that was designed for ease in handling. This high performance conductive epoxy cures quickly at elevated temperatures making it ideally suited for rapid processing and assembly.Silver-Bond 4 Electrically Conductive, Heat Resistant, Silver Epoxy Adhesive offers excellent mechanical, electrical, and physical properties at continuous operating temperatures up to 175C. This versatile silver conductive adhesive can be used for chip bonding in micro and opto-electronic hybrid circuit fabrication.Silver-Bond 4 Electrically Conductive, Heat Resistant, Silver Epoxy Adhesive has also been used in microwave applications for EMI and FRI shielding, for assembly and repair of circuit boards and electronic component manufacturing.Silver-Bond 4 Electrically Conductive, Heat Resistant, Silver Epoxy Adhesive is a smooth, soft paste that can be applied by hand application, automatic dispensers, screen-printing, transfer or stamping techniques. It is available in both a lower and higher viscosity grade for use in a variety of dis

Features & Highlights

  • Hardness, Shore D: 83
  • Appearance: Silver
  • Cure Type: Heat cure
  • Benefits: High strength Excellent mechanical, electrical properties
  • Substrates: Excellent choice for Integrated Circuits, aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, phenolic and G-10 epoxy glass boards.

Additional Information

Manufacturer:Epoxy International
Brand:Epoxy International
Part Number:Silver-Bond 4-250
Publisher:Epoxy International
Studio:Epoxy International
MPN:Silver-Bond 4-250
Item Weight:0.55 pounds
Item Size:4 x 0.2 x 0.2 inches

Silver-Bond 4 Electrically Conductive, Heat Resistant, Silver Epoxy Adhesive by Epoxy International

Buy Now:
Silver-Bond 4 Electrically Conductive, Heat Resistant, Silver Epoxy Adhesive

Brand: Epoxy International
Condition: New
Lead Time: 1 - 2 Business Days
Availability: In Stock
$699.99


Quantity:  

 


View More In Conductive Adhesives.

 


Have questions about this item, or would like to inquire about a custom or bulk order?


If you have any questions about this product by Epoxy International, contact us by completing and submitting the form below. If you are looking for a specif part number, please include it with your message.

First Name:
Last Last:
Email Address:
Your Message:

Related Best Sellers


mpn: Silver-Easy-Mix 07-250,
Mix Ratio by weight: 100:100 / Resin:Hardener Glass Transition Temp, Tg: 50 C Minimum Bond Line Thickness: 1mm Substrates: Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass board...

mpn: Flexible-Silver 19-250,
Mix Ratio by weight: 90:100 / Resin:Hardener Substrates: Metal, ceramics, glass and plastic Thixotropic Index: 4.9 Typical Application: Assembly and repair of electrical modules, flexible circuits, membrane switches, wave guides, flat cable and high ...

mpn: Silver-Bond 24-250,
Mix Ratio by weight: 100:5 / Resin:Hardener Substrates: Excellent choice for aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards Typical Application: assembly, manufacture and repair of elec...

mpn: Silver-Bond 79-250,
Substrates: Excellent choice for Integrated Circuits, aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. Operating Temperature: -40C to 175 C NASA Outgassing: Passes Thixotropic Index: 3.4...

mpn: Flexible-Silver 16-250,
Mix Ratio by weight: 100:115 / Resin:Hardener Substrates: Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. Typical Application: It can be used as a flexible "cold-solder...

mpn: Silver-Bond G2-500,
Benefits: High strengthPerfect bondEMI & RFI shieldingWave guides Substrates: Excellent choice for the Integrated Circuits, aluminum, copper, magnesium,steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. Catalyst: Anhy...

mpn: Silver-Bond 2LP-250,
Mix Ratio by weight: 100:6 / Resin:Hardener Substrates: Excellent choice aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. Operating Temperature: 50 to +170C Typical Applications: Electri...

mpn: Silver-Bond AD1-250,
Substrates: Excellent choice for Integrated Circuits, aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. Catalyst: Anhydride Hardness, Shore D: 83 Typical Applications: microwave EMI & RFI...

mpn: 8331-200ML, ean: 0779008833124,
The 8331 Silver Conductive Epoxy Adhesive: Moderate Cure is an economical electronic epoxy with good electrical and thermal conductivities. This adhesive bonds very well to a variety of surfaces. It has a convenient 1-to-1 ratio, a workable ten minut...



Privacy Policy / Terms of Service
© 2018 - inthenationalinterest.com. All Rights Reserved.