Sireda BGA153 UFS Test Socket F1 Solution Apply For 153 Ball _Pitch 0.5mm _ IC Size 11.5X13mm
Sireda BGA153 UFS Test Socket F1 Solution Apply For 153 Ball _Pitch 0.5mm _ IC Size 11.5X13mm by Sireda at In The National Interest. MPN: 17-0000040. Hurry! Limited time offer. Offer valid only while supplies last. How it works 1.F1 solution is designed for test, debug, and validation of devices of BGA, LGA, QFP, QFN, SOP, etc. 2.The compact, surface mount
1.F1 solution is designed for test, debug, and validation of devices of BGA, LGA, QFP, QFN, SOP, etc.
2.The compact, surface mount design requires no tooling, no extra place or mounting holes in the target PC board, maximizing real estate while reducing board costs.
3.Precision machined spring probes with industry proven solder balls ensure high reliability performance, easy of maintenance and reduced testing downtime
4.Fully removable double latch turning lid makes it can be used for both manual and automatic operation, and enable quick device insertion and extraction.
Features & Highlights
- Hikey960 UFS solution is available,BGA153 UFS Socket F1 Solution_11.5X13mm
- Sireda's F1 solution is for design for adanced testing purpose.
- Sireda's F1 solution is known as fast product validation.
- It helps more and more engineers to validate their platform or product sooner.
- We design some important pins for debug using. Engineer is able to monitor the signal during IC working.
|Item Weight:||0.66 pounds|
|Item Size:||1.24 x 1.78 x 1.78 inches|
|Package Weight:||1.1 pounds|
|Package Size:||0 x 0 x 0 inches|